Kyphon Inc Watch

from 8-K 42 pages Credit Agreement ($300,000,000 Revolving Credit Facility) Dated as of November 2, 2007 Between Kyphon Inc., as Borrower, and the Bank of Tokyo-Mitsubishi Ufj, Ltd. as Lender

from 8-K 136 pages Credit Agreement Dated as of January 18, 2007 Among Kyphon Inc., and Certain Subsidiaries, as Borrowers, Bank of America, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer and the Other Lenders Party Hereto Banc of America Securities LLC, as Sole Lead Arranger and Sole Book Manager

from 8-K 126 pages Credit Agreement Dated as of October 20, 2006 Among Kyphon Inc., and Certain Subsidiaries, as Borrowers, Bank of America, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer, Lasalle Bank National Association, as Syndication Agent, Wells Fargo Bank, N.A., as Documentation Agent and the Other Lenders Party Hereto Banc of America Securities LLC, as Sole Lead Arranger and Sole Book Manager

from 8-K 3 pages Annexe 1a Guaranty (Unsecured) Guaranty, in Favor of Credit Suisse, a Swiss Banking Corporation (Together With Its Successors and Assigns, Hereinafter the “Bank”), Made by the Undersigned1 Kyphon Inc., a Corporation Organized Under the Laws of the State of Delaware, U.S.A., Having Its Principal Business Office at Sunnyvale, California, U.S.A. (Hereinafter “Guarantor”) in Respect Of2 Kyphon Sàrl, Rue Du Puits-Godet 12/12a, 2000 Neuchâtel, Switzerland (Hereinafter “Borrower”)

from S-1 ~20 pages Amended and Restated Loan Agreement...