ON Semiconductor Corporation Watch

from 8-K 148 pages Credit Agreement Dated as of June 22, 2023, Among ON Semiconductor Corporation, as the Borrower, the Lenders Party Hereto, and Jpmorgan Chase Bank, N.A., as Administrative Agent Jpmorgan Chase Bank, N.A.,

from 10-K 168 pages Tenth Amendment to Credit Agreement

from 10-Q 204 pages Ninth Amendment to Credit Agreement

from 8-K 228 pages Eighth Amendment to Credit Agreement

from 10-Q 12 pages Sixth Amendment to Credit Agreement

from 8-K 205 pages Seventh Amendment to Credit Agreement

from 8-K 30 pages Fifth Amendment to Credit Agreement

from 10-Q 198 pages Fourth Amendment to Credit Agreement

from 8-K 196 pages Third Amendment to Credit Agreement

from 8-K 354 pages Second Amendment to Credit Agreement

from 8-K 279 pages First Amendment to Credit Agreement

from 8-K 15 pages Assumption Agreement (This “Assumption Agreement”), Dated as of September 19, 2016, Is Made by Fairchild Semiconductor International, Inc., a Delaware Corporation, Fairchild Semiconductor Corporation, a Delaware Corporation, Fairchild Semiconductor Corporation of California, a Delaware Corporation, Giant Holdings, Inc., a Delaware Corporation, Fairchild Semiconductor West Corporation, a Delaware Corporation, Kota Microcircuits, Inc., a Colorado Corporation, Silicon Patent Holdings, a California Corporation, Giant Semiconductor Corporation, a North Carolina Corporation, Micro-Ohm Corporation, a North Carolina Corporation and Fairchild Energy, LLC, a Maine Limited Liability Company (Collectively, the “Additional Grantors” and Each Individually, an “Additional Grantor”), in Favor of Deutsche Bank AG New York Branch, as Administrative Agent (In Such Capacity, the “Administrative Agent”) and as Collateral Agent (In Such Capacity, the “Collateral Agent”), for the Benefit of the Secured Parties (As Defined in the Credit Agreement Referred to Below). All Capitalized Terms Not Defined Herein Shall Have the Meaning Ascribed to Them in Such Credit Agreement

from 8-K 158 pages Credit Agreement Among ON Semiconductor Corporation, as Borrower the Several Lenders From Time to Time Parties Hereto and Deutsche Bank AG New York Branch, as Administrative Agent and Collateral Agent Dated as of April 15, 2016

from SC TO-C 51 pages Project Falcon $2,700,000,000 Senior Secured Credit Facilities Commitment Letter

from 8-K 51 pages Project Falcon $2,700,000,000 Senior Secured Credit Facilities Commitment Letter

from 8-K 31 pages Amendment No. 2 Dated as of June 1, 2015 to Amended and Restated Credit Agreement Dated as of October 10, 2013

from 8-K 191 pages Amendment No. 1 Dated as of May 1, 2015 to Amended and Restated Credit Agreement Dated as of October 10, 2013

from 10-Q 176 pages Amended and Restated Credit Agreement Dated as of October 10, 2013 Among Semiconductor Components Industries, LLC, as the Borrower ON Semiconductor Corporation, as Holdings the Lenders Party Hereto Jpmorgan Chase Bank, N.A. as Administrative Agent, Bank of America, N.A., the Royal Bank of Scotland PLC and Sumitomo Mitsui Banking Corporation as Co-Syndication Agents and Morgan Stanley Mufg Loan Partners, LLC, Barclays Bank PLC and Fifth Third Bank as Co-Documentation Agents J.P. Morgan Securities LLC, Merrill Lynch, Pierce, Fenner & Smith Incorporated, Rbs Securities Inc. and Sumitomo Mitsui Banking Corporation as Joint Bookrunners and Joint Lead Arrangers

from 10-Q 34 pages Amended and Restated Credit Agreement Dated as of January 31, 2013 Among Semiconductor Components Industries, LLC ON Semiconductor Corporation the Lenders Party Hereto and Sumitomo Mitsui Banking Corporation as Administrative Agent

from 10-Q 14 pages Amendment No. 1 Dated as of June 28, 2012 to Credit Agreement Dated as of December 23, 2011