TTM Technologies Inc. Watch

from 8-K 147 pages Amended and Restated Facility Agreement Dated 14 June 2023 US$150,000,000 Asset Backed Loan Facility for the Companies Listed in Schedule 1 Herein as Borrowers the Companies Listed in Schedule 1 Herein as Original Guarantors the Financial Institutions Listed in Schedule 1 Herein as Original Lenders Arranged by the Hongkong and Shanghai Banking Corporation Limited as Arranger and Issuing Bank With the Hongkong and Shanghai Banking Corporation Limited as Facility Agent and Security Trustee King & Wood Mallesons 13/F, Gloucester Tower, the Landmark 15 Queen’s Road Central Central Hong Kong T +852 3443 1000 F +852 3443 1299 WWW.KWM.com Contents

from 8-K 134 pages Amended and Restated Abl Credit Agreement Among TTM Technologies, Inc. as Borrower, the Several Lenders From Time to Time Parties Hereto, Jpmorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Syndication Agents, and Hsbc Securities (USA) Inc., as Documentation Agent Dated as of May 30, 2023, Jpmorgan Chase Bank, N.A., Barclays Bank PLC, Bank of America, N.A. and Truist Securities, Inc. as Joint Lead Arrangers and Joint Bookrunners

from 8-K 126 pages Amended and Restated Term Loan Credit Agreement Among TTM Technologies, Inc. as Borrower, the Several Lenders From Time to Time Parties Hereto, Jpmorgan Chase Bank, N.A., as Administrative Agent, Dated as of May 30, 2023, Jpmorgan Chase Bank, N.A., Barclays Bank PLC, Bofa Securities, Inc, Hsbc Securities (USA) Inc. Truist Securities, Inc. as Joint Lead Arrangers and Joint Bookrunners

from 10-Q 1 page Chinese Revolver

from 8-K 141 pages Amended and Restated Facility Agreement Dated 4 June 2019 US$150,000,000 Asset Backed Loan Facility for the Companies Listed in Schedule 1 Herein as Borrowers the Companies Listed in Schedule 1 Herein as Original Guarantors the Financial Institutions Listed in Schedule 1 Herein as Original Lenders Arranged by the Hongkong and Shanghai Banking Corporation Limited as Arranger and Issuing Bank With the Hongkong and Shanghai Banking Corporation Limited as Facility Agent and Security Trustee King & Wood Mallesons 13/F, Gloucester Tower, the Landmark 15 Queen’s Road Central Central Hong Kong T +852 3443 1000 F +852 3443 1299 WWW.KWM.com Contents

from 8-K 123 pages Abl Credit Agreement Among TTM Technologies, Inc. as Borrower, the Several Lenders From Time to Time Parties Hereto, Jpmorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, as Syndication Agent, and the Royal Bank of Scotland PLC and Hsbc Securities (USA) Inc., as Documentation Agents Dated as of May 31, 2015 J.P. Morgan Securities LLC and Barclays Bank PLC, as Joint Lead Arrangers and Joint Bookrunners

from 8-K 109 pages Term Loan Credit Agreement Among TTM Technologies, Inc. as Borrower, the Several Lenders From Time to Time Parties Hereto, Jpmorgan Chase Bank, N.A., as Administrative Agent, Barclays Bank PLC, as Syndication Agent, and the Royal Bank of Scotland PLC and Hsbc Securities (USA) Inc., as Documentation Agents Dated as of May 31, 2015 J.P. Morgan Securities LLC and Barclays Bank PLC, as Joint Lead Arrangers and Joint Bookrunners

from 8-K 125 pages Facility Agreement Dated 22 May 2015 US$150,000,000 Asset Backed Loan Facility for TTM Technologies Enterprises (Hk) Limited as Borrower Arranged by the Hongkong and Shanghai Banking Corporation Limited as Arranger With the Hongkong and Shanghai Banking Corporation Limited as Original Lender, Facility Agent, Security Trustee and Issuing Bank King & Wood Mallesons 13/F, Gloucester Tower, the Landmark 15 Queen’s Road Central Central Hong Kong T +852 3443 1000 F +852 3443 1299 WWW.KWM.com Contents

from 8-K 123 pages Facility Agreement Dated 14 September 2012 US$540,000,000 Credit Facility for the Companies Listed in Schedule 1 Herein as Borrowers With the Hongkong and Shanghai Banking Corporation Limited as Facility Agent and Standard Chartered Bank (Hong Kong) Limited as Security Trustee Allen & Overy Contents

from 8-K/A 136 pages Credit Agreement Dated 16 November 2009 as Amended and Restated on 30 March 2010 US$582,500,000 Credit Facility for the Companies Listed in Schedule 1 Herein as Borrowers Coordinated by the Hongkong and Shanghai Banking Corporation Limited With the Hongkong and Shanghai Banking Corporation Limited as Facility Agent and Standard Chartered Bank (Hong Kong) Limited as Security Agent Allen & Overy Contents

from 8-K 126 pages Credit Agreement Dated 16 November 2009 US$582,500,000 Credit Facility for the Companies Listed in Schedule 1 Herein as Borrowers Coordinated by the Hongkong and Shanghai Banking Corporation Limited With the Hongkong and Shanghai Banking Corporation Limited as Facility Agent and Standard Chartered Bank (Hong Kong) Limited as Security Agent Allen & Overy Contents

from 8-K 134 pages $240,000,000 Credit Agreement Dated as of October 27, 2006, Among TTM Technologies, Inc., as Borrower, the Guarantors Party Hereto, as Guarantors, the Lenders Party Hereto and Ubs Securities LLC, as Sole Lead Arranger and Sole Bookrunner, Bank of America, N.A., Comerica Bank and Silicon Valley Bank, as Co-Documentations Agents, Jpmorgan Chase Bank, N.A., as Syndication Agent, and Ubs AG, Stamford Branch, as Issuing Bank, Administrative Agent and Collateral Agent, and Ubs Loan Finance LLC, as Swingline Lender

from 8-K 98 pages $25,000,000 Second Amended and Restated Credit Agreement Among TTM Technologies, Inc., as Borrower, the Domestic Subsidiaries of the Borrower From Time to Time Parties Hereto, as Guarantors, the Lenders Parties Hereto and Wachovia Bank, National Association (Formerly Known as First Union National Bank), as Administrative Agent and Comerica Bank, as Syndication Agent and Silicon Valley Bank, as Documentation Agent and Wachovia Capital Markets, LLC (Formerly Known as First Union Capital Markets Corp.), as Lead Arranger and Book Manager Dated as of July 15, 2005

from S-3 ~10 pages Third Amendment to Amended and Restated Credit Agreement

from S-3/A ~5 pages Second Amendment to Amended and Restated Credit Agreement