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MagnaChip Semiconductor S.A.

Material Contracts Filter

EX-10.54
from S-4/A 2 pages MagnaChip Semiconductor Profit Sharing Plan as Adopted on December 31, 2009 and as Amended on February 15, 2010
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EX-10.16
from S-4/A 10 pages This Design Migration Agreement (“Agreement”) Is Made the 01 Day of May 2007 Between Arm Limited Whose Registered Office Is Situated at 110 Fulbourn Road , Cambridge, Cbi 9nj, United Kingdom (“Arm”); and MagnaChip Semiconductor, Ltd. Whose Principal Place of Bussiness Is Situated at C/O 891 Daechi-Dong, Gangnam-Gu, Seoul 135-738, Korea (“Customer”). the Parties Hereby Agree as Follows;
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EX-10.12
from S-4/A 22 pages Technology Licence Agreement Between Advanced Risc Machines Limited and Lg Semicon Company Limited Dated 5th October 1995
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EX-10.10
from S-4/A 2 pages This Amendment (“Amendment”) Is Effective From the 16th of October 2006 (“Effective Date”) Between Arm Limited Whose Registered Office Is Situated at 110 Fulbourn Road, Cambridge Cb1 9nj, United Kingdom (“Arm”); and MagnaChip Semiconductor Ltd Whose Principal Place of Business Is Situated at 891 Daechi-Dong, Gangnam-Gu, Seoul 135-738, Seoul, Korea (“Magnachip”) Whereas A. This Amendment (Defined Above) Refers to and Amends the Terms and Conditions of the Technology Licence Agreement, Arm Document Number Lec-Tla-00142, Between Arm and Magnachip Dated 16th December 1996 (The “Agreement”). B. the Agreement Was Assigned by Lg Semicon Company Limited to Hyundai Electronics Ltd (“Hyundai”) in the Month of March 2000. C. Hyundai Changed Its Name to Hynix Semiconductor Inc (“Hynix”) on 29th March 2001. D. Magnachip Purchased the System Ic Business of Hynix on 6th October 2004 and the Agreement Was Assigned to Magnachip. E. Magnachip Has Requested and Arm Has Agreed to License an Additional Model to Magnachip Under the Terms and Conditions of the Agreement. It Is Agreed as Follows: 1. That All Definitions Contained in the Agreement Shall Have the Same Meanings and Apply to This Amendment. 2. Delete the Following From Clause 1.22(iii) of the Agreement “Subject to the Payment by Magnachip of the Fee(s) Set Out in Clause 9.2” and Replace With the Following: “Subject to the Payment by Magnachip of the Fee(s) Set Out in Clauses 9.6a, 9.6b and 9.6c as Applicable” 3. After Clause 9.6, Add Clauses 9.6a and 9.6b to the Agreement as Follows: “9.6a in Consideration of Arm Agreeing to Licence the Model Identified in Schedule 3 Part C Item C7 to Magnachip, Magnachip Shall Pay, to Arm, the Sum of [*****] Due on the Effective Date of the Amendment. 9.6b in Consideration of Arm Agreeing to Provide Support and Maintenance Services to Magnachip in Respect of the Model Identified in Schedule 3 Part C Item C7, Magnachip Shall Pay, to Arm, the [******] Due on the Effective Date of the Amendment
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EX-10.8
from S-4/A 21 pages Amended and Restated License Agreement
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EX-10.5
from S-4/A 41 pages General Service Supply Agreement Between Hynix Semiconductor Inc. and MagnaChip Semiconductor, Ltd. October 6, 2004
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EX-10.49
from S-4 13 pages Form of Indemnification Agreement
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EX-10.34
from S-4 15 pages This Technology License Agreement (“Tla”) Is Made the 20th Day of May Day of 2004 (“Effective Date”) Between Whereas Licensee Has Requested Arm and Arm Has Agreed to License to Licensee Certain Arm Technology (Defined Below) on the Following Terms and Conditions. 1. Definitions 1.1 “Arm Compliant Product” Means an Integrated Circuit Incorporating an Arm Compliant Core as Defined in the Relevant Annex 1. 1.2 “Arm Technology” Means Any or All, as the Context Admits, of the Technology Identified in Each Annex 1 and Any Updates Thereto Delivered by Arm to Licensee
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EX-10.33
from S-4 17 pages This Technology License Agreement (“Agreement”) Is Made and Entered Into the 22 Day of August 2001 (“Effective Date”) Between Whereas A. Licensee Has Requested Arm and Arm Has Agreed to License Licensee to Manufacture and Distribute Certain Arm Secure Core Based Products (As Defined Below) on the Following Terms and Conditions. B. Therefore, in Consideration of the Mutual Representations, Warranties, Covenants, and Other Terms and Conditions Contained Herein, the Parties Agree as Follows: 1. Definitions 1.1 “Arm Secure Core” Means the Arm Secure Core Identified in the Technical Reference Manual [Ddi-0207-A]. 1.2 “Arm Secure Core Synthesizable Source” Means Together; (I) the Synthesizable Rtl; (II) the Synthesis Scripts; and (III) the Synthesis Reference Deliverables. 1.3 “Armv4t Instruction Sets” Means Both the Armv4 Instruction Set and Thumb Instruction Set as Defined in the Arm Architecture Reference Manual [Arm Ddi 0100]
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EX-10.32
from S-4 19 pages Arm7201tdsp Device Licence Agreement This Device Licence Agreement (“The Agreement”) Is Made the 26th Day of August 1997 Between Advanced Risc Machines Limited Whose Registered Office Is Situated at 90, Fulbourn Road, Cherry Hinton, Cambridge, Cb1 4jn (“Arm”) and Lg Semicon Company Limited Whose Principle Place of Business Is Situated at 16 Woomyeon-Dong, Seocho-Qu, Seoul 137-140 Korea (“Lgs”) It Is Hereby Agreed as Follows; Except to the Extent That the Terms of This Agreement Are Inconsistent With the Terms of the 1996 Agreement, in Which Event the Terms of This Agreement Shall Prevail, This Agreement Shall Be Without Prejudice to the Terms of the 1996 Agreement and the Terms of the 1996 Agreement Shall Apply. 1. Definitions the Following Terms Shall Have the Following Meanings Where Used in This Agreement; 1.1 “1996 Agreement” Shall Mean the Technology Licence Agreement Between Arm and Lgs Dated the 16th December 1996. 1.2 “Arm Services” Shall Mean the Services Described in Schedule 1 Which Arm Shall Provide to Lgs Pursuant to This Agreement
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EX-10.31
from S-4 21 pages This Technology Licence Agreement (The “Agreement”) Is Made the 16th Day of December 1996 Between Whereas 1. Definitions 1.1 “Arm Compliant Product” Shall Mean Any Single Silicon Chip Developed by Lgs Which Contains, at a Minimum: (I) an Arm7tdmi Core; or (II) a Modified Arm7tdmi Core, Which Has Been Verified in Accordance With the Provisions of Clause 3. 1.2 “Arm7tdmi Core” Shall Mean the Device as Described and Identified in the Arm7tdmi Datasheet Identified in Schedule 2 Part a Item A1. 1.3 “Arm Instruction Set” Shall Mean Both the Arm Instruction Set and Thumb Instruction Set as Each Are Defined in the Arm Architecture and Reference Manual Identified in Schedule 2 Part a Item A2. 1.4 “Authorised Distributor” Shall Mean Those Distributors Appointed, in Writing, by Lgs. 1.5 “Avs” Shall Mean the Arm Architectural Validation Suite in Binary Code Format Schedule 2 Part B Section 2 Item T3
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EX-10.30
from S-4 18 pages This Technology License Agreement (“Agreement”) Is Made and Entered Into the Day of July 2001 (“Effective Date”) Between Whereas A. Licensee Has Requested Arm and Arm Has Agreed to License Licensee to Manufacture and Distribute Certain Arm Secure Core Based Products (As Defined Below) on the Following Terms and Conditions. B. Therefore, in Consideration of the Mutual Representations, Warranties, Covenants, and Other Terms and Conditions Contained Herein, the Parties Agree as Follows: 1. Definitions 1.1 “Arm Secure Core” Means the Arm Secure Core Identified in the Technical Reference Manual [Ddi-0207-A]. 1.2 “Arm Secure Core Synthesizable Source” Means Together; (I) the Synthesizable Rtl; (II) the Synthesis Scripts; and (III) the Synthesis Reference Deliverables. 1.3 “Armv4t Instruction Sets” Means Both the Armv4 Instruction Set and Thumb Instruction Set as Defined in the Arm Architecture Reference Manual [Arm Ddi 0100]
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EX-10.29
from S-4 17 pages Celis/Hynix Rfid Development and Licensing Agreement Article 1. Definitions
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EX-10.28
from S-4 22 pages License Agreement (Trenchdmos) Dated March 18 2005 Between Advanced Analogic Technologies Inc. and MagnaChip Semiconductor, Ltd. License Agreement
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EX-10.27
from S-4 22 pages License Agreement (Modularbcd) Dated March 18, 2005 Between Advanced Analogic Technologies Inc. and MagnaChip Semiconductor, Ltd. License Agreement
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EX-10.26
from S-4 24 pages R&D Equipment Utilization Agreement
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EX-10.25
from S-4 26 pages MagnaChip Semiconductor LLC California Equity Incentive Plan
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EX-10.24
from S-4 20 pages MagnaChip Semiconductor LLC Equity Incentive Plan
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EX-10.23
from S-4 11 pages Service Agreement
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EX-10.22
from S-4 11 pages Service Agreement
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