SunEdison Semiconductor Ltd – Credit Agreements – BamSEC

Warning: Large portions of this site require JavaScript enabled in order to function properly. Please make sure JavaScript is enabled in your browser.

Please let us know at support@bamsec.com if you have any questions or concerns.

Search in Documents

Key Exhibits

External Links

SEC EDGAR

Credit Agreements Filter

from DEFA14A 51 pages Limited Consent to Credit Agreement

from 8-K 51 pages Limited Consent to Credit Agreement

from 10-K 7 pages Credit Type Number Deputy Branch Manager Team Head Team Member Loan Agreement Borrower: Memc Korea Company Stamp Duty: Three Hundred Fifty Thousand Korean Won (Krw 350,000) Affix Revenue Stamp Here Attach Reverse Side of Electronic Revenue Stamp Loan Agreement

from 10-K 8 pages Credit Transaction Agreement

from 10-K 10 pages To: Shinhan Bank

from 10-K 18 pages First Amendment to Credit Agreement

from 8-K 423 pages Credit Agreement Dated as of May 27, 2014 Among SunEdison Semiconductor B.V., as Borrower, SunEdison Semiconductor Limited, Goldman Sachs Bank USA, as Administrative Agent Goldman Sachs Bank USA, as Sole Lead Arranger and Sole Syndication Agent Goldman Sachs Bank USA, and Macquarie Capital (USA) Inc., as Joint Bookrunners and the Lenders Party Hereto