EX-10.1
from 8-K
120 pages
$3,000,000,000 Credit Agreement Dated as of April 29, 2022, by and Among Advanced Micro Devices, Inc., as Borrower, the Lenders Referred to Herein, as Lenders, and Wells Fargo Bank, National Association, as Administrative Agent, Swingline Lender and an Issuing Lender Wells Fargo Securities, LLC, Bofa Securities, Inc., Barclays Bank PLC, Credit Suisse Loan Funding LLC, and Jpmorgan Chase Bank, N.A., as Joint Lead Arrangers and Joint Bookrunners Bank of America, N.A. Barclays Bank PLC, Credit Suisse AG, New York Branch, and Jpmorgan Chase Bank, N.A., as Co-Syndication Agents, Wells Fargo Securities, LLC, as Sole Sustainability Structuring Agent
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EX-10.1
from 8-K
159 pages
$500,000,000 Credit Agreement Dated as of June 7, 2019, by and Among Advanced Micro Devices, Inc., as Borrower, the Lenders Referred to Herein, as Lenders, and Wells Fargo Bank, National Association, as Administrative Agent, Swingline Lender and an Issuing Lender Wells Fargo Securities, LLC, Bofa Securities, Inc. and Jpmorgan Chase Bank, N.A., as Joint Lead Arrangers and Joint Bookrunners Bank of America, N.A. and Jpmorgan Chase Bank, N.A., as Co-Syndication Agents,
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EX-10.1
from 10-Q
5 pages
Whereas, the Borrower, the Various Financial Institutions Parties Thereto (Collectively, the “Lenders”), Morgan Stanley Senior Funding, Inc. (“Morgan Stanley”), as the Administrative Agent (In Such Capacity, the “Administrative Agent”) for the Lenders, Wells Fargo Bank, N.A., as the Collateral Agent (In Such Capacity, the “Collateral Agent”) for the Lenders and Morgan Stanley, as the Syndication Agent (In Such Capacity, the “Syndication Agent”, And, Together With the Administrative Agent and the Collateral Agent, the “Agents”) for the Lenders, Have Heretofore Entered Into That Certain Credit Agreement, Dated as of October 24, 2006 (The “Credit Agreement”); Whereas, the Borrower Has Requested That the Administrative Agent and the Lenders Amend the Credit Agreement in the Manner Provided for Herein; and Whereas, the Administrative Agent and the Lenders Are Willing to Amend the Credit Agreement in the Manner and Subject to Certain Limitations and Conditions as Provided for Herein; Now, Therefore, in Consideration of the Premises Contained Herein, the Parties Hereto Agree as Follows: 1. Defined Terms. Unless Otherwise Defined Herein, Terms Which Are Defined in the Credit Agreement and Used Herein as Defined Terms Are So Used as So Defined. 2. Amendment to the Credit Agreement. (A) Section 7.5(b)(xi) of the Credit Agreement Is Hereby Amended by Deleting the Number “$100,000,000” and Replacing It With “$250,000,000”. (B) Schedules 4.1(b), 4.9, 4.15 and 4.19 to the Credit Agreement Are Hereby Replaced With the Attached Schedules 4.1(b), 4.9, 4.15 and 4.19, Respectively. 3. Representations, Warranties, Covenants and Acknowledgments
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EX-10.1
from 8-K
110 pages
$2,500,000,000 Credit Agreement Among Advanced Micro Devices, Inc., as Borrower, the Several Lenders From Time to Time Parties Hereto, Morgan Stanley Senior Funding, Inc., as Administrative Agent Wells Fargo Bank, N.A., as Collateral Agent and Morgan Stanley Senior Funding, Inc., as Syndication Agent Dated as of October 24, 2006 Morgan Stanley Senior Funding, Inc., as Sole Lead Arranger Morgan Stanley Senior Funding, Inc., as Sole Bookrunner
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EX-10.1
from 8-K
199 pages
Amendment Agreement to the Term Loan Facility Agreement Dated 21 April 2004 for AMD Fab 36 Limited Liability Company & Co. Kg as Borrower AMD Fab 36 Holding Gmbh Advanced Micro Devices, Inc. Abn Amro Bank N.V., Commerzbank Aktiengesellschaft, Deutsche Bank Luxembourg S.A., Dresdner Kleinwort, Kfw, Landesbank Hessen- Thüringen Girozentrale and Landesbank Sachsen Girozentrale as Mandated Lead Arrangers and Other Financial Institutions Named Herein and Dresdner Bank AG, Niederlassung Luxemburg as Facility Agent With Dresdner Bank AG in Berlin as Security Agent and Reporting Agent
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