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Multi Fineline Electronix Inc

Formerly NASDAQ: MFLX

Material Contracts Filter

EX-10.97
from 10-Q 2 pages Facility Offer Letter
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EX-10.94
from 10-Q 3 pages The Following Is Not a Contract of Employment. Instead, It Is a Written Offer of Employment That Will Remain Open Until May 25, 2015, and Contemplates a Start Date for Your Employment of No Later Than June 15, 2015. This Letter Will Also Set Forth Some of the Terms of Your Prospective Employment With Mflex. Salary You Will Receive a Bi-Weekly Salary of $14,230.77 ($370,000 Annualized) Based on Full-Time Employment. Your Performance and Salary Will Be Reviewed During Your Annual Review, Which Is Typically Conducted in January Each Year. Performance Bonus
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EX-10
from 10-Q 5 pages Multi-Fineline Electronix, Inc. 2014 Equity Incentive Plan Notice of Stock Appreciation Right Grant
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EX-10
from 10-Q 5 pages Multi-Fineline Electronix, Inc. 2014 Equity Incentive Plan Notice of Stock Unit Award
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EX-10.89
from 8-K 2 pages Material contract
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EX-10.87
from 10-Q 2 pages Facility Offer Letter
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EX-10.85
from 8-K 2 pages Facility Offer Letter
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EX-10.83
from 10-Q 1 page Material contract
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EX-10.82
from 10-Q 20 pages Master Development and Supply Agreement
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EX-10.81
from 8-K 2 pages Facility Offer Letter
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EX-10.77
from 8-K 20 pages Parent Guaranty
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EX-10.79
from 8-K 40 pages Multi-Fineline Electronix, Inc. 2004 Stock Incentive Plan
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EX-10.76
from 8-K 90 pages Dated 17 January 2012 Multi-Fineline Electronix Singapore Pte. Ltd. as Borrower Jpmorgan Chase Bank, N.A., Singapore Branch as Mandated Lead Arranger the Banks and Financial Institutions Listed in Schedule 1 as Lenders Jpmorgan Chase Bank, N.A., Acting Through Its Hong Kong Branch as Facility Agent and Jpmorgan Chase Bank, N.A., Acting Through Its Hong Kong Branch as Security Agent US$50,000,000 Facility Agreement
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EX-10.78
from 8-K 36 pages Multi-Fineline Electronix, Inc. Change in Control Plan
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EX-10.74
from 10-Q 2 pages Second Supplemental Agreement to Agreement for Sales of Buildings in Stock
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EX-10.73
from 10-Q 2 pages Agreement on the Escrow of Transaction Funds for Building Stock
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EX-10.72
from 10-Q 2 pages Guarantee Letter Regarding the Purchasing of the Land and the Buildings Between Mfc and Wgsz 2011 1 6 00046543 (2004) 20901 32,313,566.00
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EX-10.71
from 10-Q 2 pages Supplemental Agreement to Agreement for Sales of Buildings in Stock
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EX-10.70
from 10-Q 12 pages Agreement for Sales of Buildings in Stock No.: Su Wu Qi 201101060075 Made by Bureau of Housing and Urban-Rural Development of Suzhou City 2010 Edition Notice to Users - 1
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EX-10.64
from 8-K 91 pages April, 2010 Mflex (Chengdu) Co., Ltd. and Beijing Shiyuan Xida Construction and Technology Company, a Sole Subsidiary of China Electronics Engineering Design Institute Engineering, Procurement and Construction/Turn Key Project Agreement Agreement Number 1
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