EX-10.1
from 8-K
152 pages
Credit Agreement Dated as of March 19, 2013 Among Rf Micro Devices, Inc., as the Borrower, the Subsidiaries of the Borrower Identified Herein, as the Guarantors, Bank of America, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer, the Other Lenders Party Hereto and Silicon Valley Bank, Suntrust Bank, Td Bank, N.A. and Union Bank, N.A., as Co-Documentation Agents Arranged By: Bank of America Merrill Lynch, as Sole Lead Arranger and Sole Book Manager
12/34/56