Triquint Semiconductor Inc Watch

from 10-Q 2 pages [Signature Pages Follow]

from 8-K 115 pages Credit Agreement Dated as of September 30, 2010 Among Triquint Semiconductor, Inc., as the Borrower, the Subsidiaries of the Borrower Identified Herein, as the Guarantors, Bank of America, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer, the Other Lenders Party Hereto and Union Bank, N.A. and Wells Fargo Bank, National Association, as Co-Documentation Agents Arranged By: Banc of America Securities LLC, as Sole Lead Arranger and Book Manager

from 8-K 9 pages First Amendment to Credit Agreement

from 8-K 113 pages Credit Agreement Dated as of June 27, 2008 Between Triquint Semiconductor, Inc. and Bank of America, N.A

from S-8 ~5 pages 2000 Modified Esop Loan Agreement Modification Dated as of December 14, 2000 Sawtek Inc. Employee Stock Ownership and 401(k) Plan and Trust 2000 Modified Esop Loan Agreement