Triquint Semiconductor Inc Watch

from 425 8 pages First Amendment to Agreement and Plan of Merger and Reorganization

from 425 6 pages First Amendment to Agreement and Plan of Merger and Reorganization

from 8-K 6 pages First Amendment to Agreement and Plan of Merger and Reorganization

from 425 108 pages Agreement and Plan of Merger and Reorganization

from 425 108 pages Agreement and Plan of Merger and Reorganization

from 8-K 108 pages Agreement and Plan of Merger and Reorganization

from 8-K 7 pages Equity Purchase Agreement

from 8-K 13 pages Transition Services Agreement by and Between Agere Systems Inc. as Seller and Triquint Semiconductor, Inc. as Buyer Dated as of January 2, 2003

from 8-K 7 pages Purchase Agreement - Goods

from 8-K 18 pages Intellectual Property Agreement by and Between Agere Systems Inc. and Triquint Semiconductor, Inc. Dated as of January 2, 2003

from 8-K 5 pages Assignment and Bill of Sale and Assumption Agreement

from 8-K 5 pages Assignment and Bill of Sale and Assumption Agreement

from 8-K 5 pages Amendment No. 1 to the Asset Purchase Agreement

from 8-K 68 pages Asset Purchase Agreement by and Between Agere Systems Inc. as Seller and Triquint Semiconductor, Inc. as Buyer Dated as of October 21, 2002

from 8-K 10 pages [***] Certain Information in This Document Has Been Omitted and Filed Separately With the Commission. Confidential Treatment Has Been Requested With Respect to the Omitted Portions

from 8-K 3 pages [***] Certain Information in This Document Has Been Omitted and Filed Separately With the Commission. Confidential Treatment Has Been Requested With Respect to the Omitted Portions. Side Letter to the Backend Foundry Agreement Between Triquint Semiconductor, Inc., 2300 Ne Brookwood Parkway, Hillsboro, or 97124 and Infineon Technologies Aktiengesellschaft, München, Federal Republic of Germany Price: Pas: [***] Euro [***] Per Piece Ass: [***] Euro [***] Per Piece Pas and Ass Charges Are Based on Good Devices Out. Notwithstanding Any Statement to the Contrary in the Backend Foundry Agreement, or Any Exhibits, the Following Terms and Conditions Apply to Orders of [***] Devices: Package Type: [***] Ordering Code: [***] Chip: [***]

from 8-K 16 pages Backend Foundry a G R E E M E N T Between Triquint Semiconductor, Inc., 2300 Ne Brookwood Parkway, Hillsboro, or 97124 - Hereinafter Referred to as “Customer” - And Infineon Technologies Aktiengesellschaft, München, Federal Republic of Germany - Hereinafter Referred to as “Supplier” - - Customer and Supplier Are Hereinafter Referred to as “Party” or “Parties”

from 8-K 18 pages Basic Supply Agreement Relating to the Supply of Highly Reliable Semiconductor Products (Hirel) and the Assignment of Customer Contracts Between Infineon Technologies AG, München, Federal Republic of Germany - Hereinafter Referred to as “Seller” - And Triquint Semiconductor, Inc., 2300 Ne Brookwood, Parkway, Hillsboro, or 97124 - Hereinafter Referred to as “Buyer” - Seller and Buyer Are Hereinafter Referred to as “Parties”

from 8-K 10 pages Transition Services Agreement

from 8-K 20 pages Cooperation Agreement by and Between Triquint Semiconductor, Inc. (Hereinafter Referred to as “Tqs”) and Infineon Technologies AG, (Hereinafter Referred to as “Infineon”) on Cooperation Efforts in the Field of Wireless System Platforms